-
1 Chemical Mechanical Planarization
Chemistry: CMPУниверсальный русско-английский словарь > Chemical Mechanical Planarization
-
2 химико-механическая полировка
химико-механическая полировка
химико-механическое выравнивание
Метод удаления слоев твердого тела с помощью химико-механической полировки, выполняемой с целью выравнивания поверхности и выявления конфигурации межметаллических соединений; ключевой заключительный процесс поточного производства интегральных микросхем.
[ http://www.cscleansystems.com/glossary.html]Тематики
Синонимы
EN
Русско-английский словарь нормативно-технической терминологии > химико-механическая полировка
-
3 химико-механическое выравнивание поверхности или полирование
Универсальный русско-английский словарь > химико-механическое выравнивание поверхности или полирование
См. также в других словарях:
Chemical-mechanical planarization — Chemical Mechanical Polishing/Planarization is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. Contents 1 Description 2… … Wikipedia
Chemical Mechanical Polishing — Chemisch mechanisches Polieren (CMP) (engl: chemical mechanical polishing, auch chemical mechanical planarization) ist ein Polierverfahren in der Waferbearbeitung um sehr dünne Schichten gleichmäßig abzutragen. Diese Methode wurde an US… … Deutsch Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
Chemisch-mechanisches Polieren — Chemisch mechanisches Polieren, auch chemisch mechanisches Planarisieren (CMP, engl: chemical mechanical polishing, auch chemical mechanical planarization) ist ein Polierverfahren in der Waferbearbeitung um dünne Schichten gleichmäßig abzutragen … Deutsch Wikipedia
Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… … Wikipedia
Surface finishing — is a broad range of industrial processes that alter the surface of a manufactured item to achieve a certain property.[1] Finishing processes may be employed to: improve appearance, adhesion or wettability, solderability, corrosion resistance,… … Wikipedia
Microfabrication — Synthetic detail of a micromanufactured integrated circuit through four layers of planarized copper interconnect, down to the polysilicon (pink), wells (greyish) and substrate (green) Microfabrication is the term that describes processes of… … Wikipedia
Copper-based chips — are semiconductor integrated circuits, usually microprocessors, which use copper for interconnections. Since copper is a better conductor than aluminium, chips using this technology can have smaller metal components, and use less energy to pass… … Wikipedia
Shallow trench isolation — (STI), also known as Box Isolation Technique , is an integrated circuit feature which prevents electrical current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers… … Wikipedia
Chemisch-mechanische Politur — Chemisch mechanisches Polieren (CMP) (engl: chemical mechanical polishing, auch chemical mechanical planarization) ist ein Polierverfahren in der Waferbearbeitung um sehr dünne Schichten gleichmäßig abzutragen. Diese Methode wurde an US… … Deutsch Wikipedia
Copper interconnect — Copper based chips are semiconductor integrated circuits, usually microprocessors, which use copper for interconnections. Since copper is a better conductor than aluminium, chips using this technology can have smaller metal components, and use… … Wikipedia
